The Hi-MO X6 Max Artist symbols aesthetics with no compromise on power

LONGi has gone beyond just aesthetics with the Hi-MO X6 Max Artist. While the exterior boasts an ultra-sleek, uniform black appearance, the real magic lies within its advanced technological features that ensure high efficiency and robust power output.

It offers up to 410W of power and features LONGi’s HPBC (Hybrid Passivated Back Contact) technology which is one of the driving factors behind its impressive performance. By eliminating front-side electrical components, LONGi has created a solar module that maximizes the exposure of solar cells to sunlight while maintaining a clean, all-black surface that is free from visible wiring or solder points.

The benefits of back-contact technology extend far beyond aesthetics

We have repeatedly stated that we believe that back contact technology will be the future path of solar technology that the industry will follow in the medium term. This is because it has several advantages over conventional technologies. Two of these are most impactful.

1. Back contact cells have higher efficiency

By moving the electrical contacts to the back, the front surface is exposed to more sunlight, allowing the cells to capture more energy. This results in higher overall module efficiency and power output. However, it's not just the expected maximum wattage that matters. What really determines performance is the operating time during the day. A back-contact module generally performs better in low light conditions than conventional technologies such as TOPCon. This means that they start working early in the morning and finish later in the day, when the last rays of sunshine hit the horizon. The result is higher energy output and this economic value and higher yields.

2. Back contact modules provide enhanced durability and reliability

LONGi back contact modules use a back contact soldering technology that deploys a single-line solder structure instead of the traditional Z-shaped structure. This cell contacting results in lower mechanical stress on the cells and increases the resistance to microcracks and thus also the protection of the cells since the cell edge stress is almost halved.

Therefore, with fewer soldered connections and less stress on the front side of the module, back-contact solar panels are more durable and have good degradation parameters.

Together with advanced heat dissipation, which is particularly important for hot climates to ensure efficiency, and the mentioned low light performance to maximize energy generation even on overcast days, back contact modules unite everything residential and C&I customers can ask for.

Aesthetics and power combined - Introducing the Hi-MO X6 Max series with HPBC and wafer with TaiRay Inside leading to significant technical upgrades and benefits

The release of the Hi-MO X6 Max marks the first time that TaiRay Inside technology and HPBC cell technology have been combined to achieve another technical breakthrough. This includes significant improvements in module efficiency, first-year and PID degradation, temperature coefficient, mechanical strength and cost performance.

Technological enhancements

With TaiRay Inside-stacked HPBC high-efficiency cell technology, the first-year degradation is reduced to 1% and the temperature coefficient is optimized to -0.28%/°C which improves the power output performance of the module. Module efficiency is increased to 23.3% while the overall PID degradation of the module is optimized, too. This is due to the improved Recharge Czochralski (RCz) process used in the production of monocrystalline silicon ingots. As a result, LONGi TaiRay Inside silicon wafers can achieve a more uniform axial resistance distribution without having to shorten the ingot length. For the same ingot length, the resistance ratio between the ends is halved, resulting in more efficient cells.

Mechanical enhancements

Conventional wafers are susceptible to lattice dislocations, defects within its crystal structure, under pressure. This may result in hidden cracks. The TaiRay Inside wafers have improved mechanical properties. Their tested bending strength is 16% higher than that of conventional wafers, ensuring a higher break resistance. Combined with the single-line soldering structure and a 48% reduction in cell edge stress, the probability of hidden cracks is reduced by up to 80%+ for improved reliability performance. In addition, modules with TaiRay Inside technology wafers have reduced DC transmission loss compared to 210R wafer module products to improve power generation.

Cost and risk reduction

The new M11 wafer size reduces industrial chain costs, engineering costs, and module transportation costs due to improved container utilization during transportation, and balance of system (BOS) costs. Downstream risks are also reduced. For example, the 72-cell version of the Hi-MO X6 Max can reduce transportation costs by $0.61/kW compared to the previous Hi-MO X6 module and improve 40HC container utilization by 4.4% to achieve 98.5% container utilization. Due to the power increase, the balance of system (BOS) cost on the system installation side is also reduced by 3.57% (approximately $4.16/kW) compared to the equivalent mainstream power classes.

Customer revenue is also increased compared to the use of 210R wafer-based modules. The Hi-MO X6 Max with lower current M11 wafers can effectively reduce the power transmission cable loss by 9% and increase the power generation revenue by 0.1%.

Launch of M11 TaiRay Inside wafer is LONGi's response to industry-wide consensus on module size standards

The launch represents LONGi’s first large-scale transition to rectangular silicon wafers resulting in a wafer size of 182.2×191.6mm and a diagonal of 262.5mm. A 72-cell module has a size of 2382×1134mm and a 54-cell module has a size of 1800x1134.

This is a significant milestone for the Company following the industry-wide consensus on module size standards reached by nine manufacturers and the subsequent agreement on wafer size standards reached by six manufacturers in July and August 2023, respectively.

In August 2023, LONGi together with five other PV manufacturers agreed on new standard dimensions for rectangular silicon wafers and reached a consensus to use a standardized rectangular silicon wafer size of 191.Xmm for 72-cell modules.

The Hi-MO X6 Max series will have a total production capacity of more than 30GW in 2024. Hi-MO X6 series products have been shipped more than 12GW worldwide, covering more than 100 countries, and continue to meet the needs of distributed and end customers around the world.